操作系统,MLSYS,体系结构,系统安全
[SOSP’25]. Le Chen, Dahu Feng, Erhu Feng, Yingrui Wang, Rong Zhao, Yubin Xia, Pinjie Xu, Haibo Chen. Characterizing Mobile SoC for Accelerating Heterogeneous LLM Inference. Proceedings of the 31th ACM Symposium on Operating Systems Principles (SOSP’25). October, 2025.
[ISCA’25]. Dahu Feng, Erhu Feng (co-first-author), Dong Du, Pinjie Xu, Yubin Xia, Haibo Chen and Rong Zhao. Topology-Aware Virtualization over Inter-Core Connected Neural Processing Units. 2025 ACM/IEEE 52st Annual International Symposium on Computer Architecture (ISCA), Tokyo, Japan, 2025.
[ASPLOS’25]. Han Husheng, Zheng Xinyao, Wen Yuanbo, Hao Yifan, Feng Erhu, Liang Ling, Mu Jianan, Li Xiaqing , Ma Tianyun, Jin Pengwei, Song Xinkai, Du Zidong, Guo Qi, Hu Xing. TensorTEE: Unifying Heterogeneous TEE Granularity for Efficient Secure Collaborative Tensor Computing. The 30th ACM International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS 25), 2025.
[ISCA’24]. Erhu Feng, Dahu Feng, Dong Du, Yubin Xia and Haibo Chen. sNPU: Trusted Execution Environments on Integrated NPUs. 2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA), Buenos Aires, Argentina, 2024, pp. 708-723, doi: 10.1109/ISCA59077.2024.00057.
[ASPLOS’24]. Erhu Feng, Dahu Feng, Dong Du, Yubin Xia, Wenbin Zheng, Siqi Zhao, Haibo Chen. sIOPMP: Scalable and Efficient I/O Protection for TEEs. The 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS 24), 2024.
[HPCA’23]. Erhu Feng, Dong Du, Yubin Xia, and Haibo Chen. Efficient distributed secure memory with migratable merkle tree. In 2023 IEEE International Symposium on High-Performance Computer Architecture (HPCA 23), pages 347–360, 2023.
[OSDI’21]. Erhu Feng, Xu Lu, Dong Du, Bicheng Yang, Xueqiang Jiang, Yubin Xia, Binyu Zang, and Haibo Chen. Scalable Memory Protection in the PENGLAI Enclave. In 15th {USENIX} Symposium on Operating Systems Design and Implementation (OSDI 21), pp. 275-294. 2021.